Breakthrough silicon microdevices: silicon microdevices

DUJUD’s innovative TriChipLink technology provides a breakthrough approach for integrating silicon microdevices into advanced 3D electronic microsystems. Using proprietary 3D interconnection and manufacturing techniques, TriChipLink addresses long-standing challenges in microelectronics, such as manufacturability and reliability issues inherent in conventional two-dimensional configurations.

The TriChipLink system enables seamless interconnection of components such as MEMS, sensors and microcontrollers. Traditional interconnect methods, such as wire bonding and flip-chip soldering, often suffer from electrical inefficiencies and mechanical vulnerabilities, especially under thermal stress. DUJUD’s patented 3D microstructures overcome these limitations by reducing electrical losses and providing greater mechanical flexibility. These innovations deliver higher performance and durability, making TriChipLink an attractive choice for modern SiP applications where reliability is critical.

The efficiency of the technology extends to the production process, which delivers exceptional resolution and speed compared to conventional methods such as inkjet 3D printing.

Image credits: DUJUD